HTC stimulates Sense with snap-happy One series

Click your Ice Cream Sandwich


MWC 2012

HTC has brought a fresh dollop of Sense to Mobile World Congress (MWC) 2012, with the HTC One series, a collection of premium smartphones focused on audio and camera capabilities.

HTC One X

Top dog of the bunch is the HTC One X, a handset built into a polycarbonate unibody with the mighty five-core 1.5GHz Nvidia Tegra 3 processor. The One X includes a 4.7in, 1280 x 720 display and 4G functionality.

Next up is the HTC One S, which comes packing a 1.5GHz dual-core Snapdragon S4 processor. The One S comes with a 4.3in display and a thin 7.9mm body, which apparently makes it the company's thinnest mobile yet.

HTC One S

HTC is touting the phone's two choices of finish, with an ultra-matte black ceramic metal surface - said to be four times harder than anodised aluminium - and a patented light-to-dark gradient fade for those who prefer style to durability.

Last but not least is the 3.7in HTC One V, essentially a refresh of the HTC Legend.

HTC One V

All models in the range combine Android 4.0 Ice Cream Sandwich with the company's latest UI refresh, HTC Sense 4. This includes a new photography suite, HTC ImageSense, as well as audio enhancements through Beats incorporation and an integrated Dropbox feature.

The One Series promises super-fast snapping capabilities with separate photo and video capture buttons. Photographers can take shots within 0.7 seconds and focus in just 0.2 seconds, while the f/2.0 lens found on the HTC One X and One S is geared up for adverse conditions such as low light, no light and bright backlighting.

The HTC One series rolls out from April, although prices and availability are as yet unannounced. ®

Similar topics


Other stories you might like

  • Microsoft unveils Android apps for Windows 11 (for US users only)

    Windows Insiders get their hands on the Windows Subsystem for Android

    Microsoft has further teased the arrival of the Windows Subsystem for Android by detailing how the platform will work via a newly published document for Windows Insiders.

    The document, spotted by inveterate Microsoft prodder "WalkingCat" makes for interesting reading for developers keen to make their applications work in the Windows Subsystem for Android (WSA).

    WSA itself comprises the Android OS based on the Android Open Source Project 1.1 and, like the Windows Subsystem for Linux, runs in a virtual machine.

    Continue reading
  • Software Freedom Conservancy sues TV maker Vizio for GPL infringement

    Companies using GPL software should meet their obligations, lawsuit says

    The Software Freedom Conservancy (SFC), a non-profit which supports and defends free software, has taken legal action against Californian TV manufacturer Vizio Inc, claiming "repeated failures to fulfill even the basic requirements of the General Public License (GPL)."

    Member projects of the SFC include the Debian Copyright Aggregation Project, BusyBox, Git, GPL Compliance Project for Linux Developers, Homebrew, Mercurial, OpenWrt, phpMyAdmin, QEMU, Samba, Selenium, Wine, and many more.

    The GPL Compliance Project is described as "comprised of copyright holders in the kernel, Linux, who have contributed to Linux under its license, the GPLv2. These copyright holders have formally asked Conservancy to engage in compliance efforts for their copyrights in the Linux kernel."

    Continue reading
  • DRAM, it stacks up: SK hynix rolls out 819GB/s HBM3 tech

    Kit using the chips to appear next year at the earliest

    Korean DRAM fabber SK hynix has developed an HBM3 DRAM chip operating at 819GB/sec.

    HBM3 (High Bandwidth Memory 3) is a third generation of the HBM architecture which stacks DRAM chips one above another, connects them by vertical current-carrying holes called Through Silicon Vias (TSVs) to a base interposer board, via connecting micro-bumps, upon which is fastened a processor that accesses the data in the DRAM chip faster than it would through the traditional CPU socket interface.

    Seon-yong Cha, SK hynix's senior vice president for DRAM development, said: "Since its launch of the world's first HBM DRAM, SK hynix has succeeded in developing the industry's first HBM3 after leading the HBM2E market. We will continue our efforts to solidify our leadership in the premium memory market."

    Continue reading

Biting the hand that feeds IT © 1998–2021