Check out our HOT AIR INTERFACE for 5G – Huawei

"Please sir, pick my standards sir!" begs Chinese tech giant


Jockeying for position in the yet-to-be-real 5G market continues, with Huawei announcing that it's going to demo a new air interface at Mobile World Congress in March.

The Chinese giant will be showing off techniques it calls Sparse Code Multiple Access (SCMA) and Filtered-Orthogonal Frequency Division Multiplexing (F-OFDM).

In a canned release, the company says it has “proved that the new air interface design can effectively improve spectral efficiency, increase connectivity, and reduce latency, thus facilitating the deployment of customised scenarios applied to the Internet of Things (IoT) and for high bandwidth-consuming scenarios such as virtual reality.”

The company also says its full-duplex air interface's multi-path fading cancellation helps deliver 200 per cent better spectral efficiency than current systems, “laying a solid ground for future unification of TDD and FDD spectrums” (frequency-division duplex and time-division duplex respectively).

Of course, none of this would be any good if Huawei were the only player to use a technology – and there's the rub.

Along with all the other big names in the mobile market, the Chinese vendor wants its technologies to be accepted into whatever the standards bodies eventually adopt for 5G.

Having devoted, it says, $600m to development work between now and 2018 – along with 300 researchers in its 5G labs – Huawei would like a payoff. Getting “reasonable and non-discriminatory” royalties from having a standards-essential patent would be a darn good start. ®

Similar topics

Broader topics

Narrower topics


Other stories you might like

  • Iceotope: No need to switch servers to swap air-cooled for liquid-cooled
    Standard datacenter kit just needs a few tweaks, like pulling off the fans

    Liquid cooling specialist Iceotope claims its latest system allows customers to easily convert existing air-cooled servers to use its liquid cooling with just a few minor modifications.

    Iceotope’s Ku:l Data Center chassis-level cooling technology has been developed in partnership with Intel and HPE, the company said, when it debuted the tech this week at HPE’s Discover 2022 conference in Las Vegas. The companies claim it delivers energy savings and a boost in performance.

    According to Iceotope, the sealed liquid-cooled chassis enclosure used with Ku:l Data Center allows users to convert off-the-shelf air-cooled servers to liquid-cooled systems with a few small modifications, such as removing the fans.

    Continue reading
  • Gartner predicts 9.5% drop in PC shipments
    Stark contrast to 11 percent increase year-over-year in 2021 shipments

    The party is over for PC makers as figures from Gartner suggest the market is on course for a breathtaking decline this year.

    According to the analysts, worldwide PC shipments will decline by 9.5 percent, with consumer demand leading the way – a 13.5 percent drop is forecast, far greater than business PC demand, which is expected to drop by 7.2 percent year on year.

    The PC market in the EMEA region is forecast to fare even worse, with a 14 percent decline on the cards for 2022. Gartner pointed the finger of blame at uncertainty caused by conflicts, price increases and simple unavailability of products. Lockdowns in China were also blamed for an impact in consumer demand.

    Continue reading
  • Samsung beats TSMC to be first to produce 3nm chips
    Lower power consumption, improved performance, and a second generation of the technology on the way

    Samsung has started production of chips using its 3nm fabrication process, beating rival TSMC, which expects to begin making chips with its N3 node generation later this year.

    The resultant chips are claimed to reduce power consumption by up to 45 percent and improve performance by up to 23 percent, with further gains promised in a second generation of the process.

    Korea's electronics giant said it has started initial production with its 3nm process node, which introduces what the firm calls Multi-Bridge-Channel FET (MBCFET) technology. This is Samsung's version of the Gate-All-Around (GAA) transistor architecture, where the gate material wraps around the conducting channel.

    Continue reading

Biting the hand that feeds IT © 1998–2022