Managing heat in AI-driven datacenters

Adapting cooling strategies for high-density compute environments

Webinar As AI and high-performance computing (HPC) drive the demand for more powerful datacenters, managing heat becomes increasingly critical.

Traditional air-cooling methods may no longer be sufficient to handle the thermal density of modern AI systems, leading to a resurgence of liquid cooling solutions.

On September 11th at 12pm ET, Lenovo and Digital Realty will discuss the challenges of building and maintaining datacenters designed for high-performance, AI-driven workloads. This conversation will explore:

- The shift to liquid cooling: Why air cooling is becoming less viable and how liquid cooling is meeting the demands of high-density compute environments.

- Designing for high thermal density: Strategies for creating datacenters that can support the intense heat output of AI and HPC systems.

- Future-proofing your infrastructure: Insights on scaling your datacenter to accommodate the growing power and cooling needs of next-generation technologies.

This session offers advice for IT managers and datacenter operators looking to stay ahead in an increasingly demanding environment.

Register here to learn from experts how to effectively manage heat in AI datacenters and ensure your infrastructure is prepared for future challenges.

Sponsored by Lenovo.